Question

What will be the next step after slicing (process) silicon wafers?

(a) All of the mentioned

(b) Lapping

(c) Polishing

(d) Chemical

I have been asked this question in class test.

This question is from Basic Planar Process in section IC Fabrication of Linear Integrated Circuits

Answer 1

The accurate answer is (a) All of the mentioned

Paint a vivid picture of understanding with: When the silicon ingots are sliced for the given industrial dimension. It gives a rough surface and thus undergo lapping, polishing and chemical processing steps to get a smooth surface.