Question

Which of the following statement is not true?

(a) X-ray and Electron beam lithography technique, produce device dimensions down to submicron range.

(b) Ultraviolet lithography has limitation due to diffraction effects of wavelength.

(c) The cost of X-ray or Electron beam is less compared to Ultraviolet photolithography.

(d) The exposure time is less in Ultraviolet compared to X-ray or Electron beam lithography.

This question was posed to me in examination.

Asked question is from Basic Planar Process topic in division IC Fabrication of Linear Integrated Circuits

Answer 1

The accurate option is (c) The cost of X-ray or Electron beam is less compared to Ultraviolet photolithography.

Simply put: The cost of X-ray or Electron beam is very high and thus, it is an expensive process. Therefore, it is used only when very small device dimension (<1 µm) are needed.