+1 vote
in Linear Integrated Circuits by (37.1k points)
In application such as RF and IF circuits, inductor cannot be avoided. How to manage such situation?

(a) Using inductors external to IC package

(b) Thin film inductor spiral are used

(c) Thin film hybrid microwave can be used

(d) All of the mentioned

This question was posed to me in final exam.

Question is taken from Active and Passive Components of IC in portion IC Fabrication of Linear Integrated Circuits

1 Answer

0 votes
by (39.8k points)
Right option is (d) All of the mentioned

Simplify with an easy explanation: In most cases, inductors external to IC packages are used. However, thin film hybrid Microwave IC (MIC) and thin film inductor spiral can provide inductance up to 250nH.

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