Question

What is the isolation technique used in monolithic IC?

(a) PN-junction

(b) Dielectric junction

(c) Beam-lead junction

(d) All of the mentioned

The question was asked in homework.

I'd like to ask this question from Integrated Circuit Package Type, Pin Configuration and Temperature Range topic in chapter Operational Amplifier Characteristics of Linear Integrated Circuits

Answer 1

The correct answer is:

(a) PN-junction

Explanation:

In monolithic integrated circuits (ICs), PN-junction isolation is commonly used. This technique involves using the junctions formed between different types of semiconductor materials (P-type and N-type) to electrically isolate components within the IC.

• PN-junction isolation effectively separates the individual transistors and other components in the IC, preventing interference between them and ensuring that each element functions correctly.
• Dielectric junction and beam-lead junctions are techniques used in other forms of IC packaging or isolation but are less common in standard monolithic ICs.

Thus, PN-junction isolation is the most common isolation technique in monolithic ICs.